Details of the Publication
Paper Code   1359-6454
Title   In-situ observations on the creep-fatigue behaviors of Sn4Ag/Cu solder joints
Authors   Zhang Q K, Zhang Z F
Corresponding Author   张哲峰
Title of Journal   ACTA MATERIALIA
Year   2011
Volume   59
Number   15
Page   6017-6028
Abstract  
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Classification: SCI
Source: Zhang Z F
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