Details of the Publication | |||
Paper Code | 1359-6454 | ||
Title | In-situ observations on the creep-fatigue behaviors of Sn4Ag/Cu solder joints | ||
Authors | Zhang Q K, Zhang Z F | ||
Corresponding Author | 张哲峰 | ||
Title of Journal | ACTA MATERIALIA | ||
Year | 2011 | ||
Volume | 59 | ||
Number | 15 | ||
Page | 6017-6028 | ||
Abstract | |||
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Full Text Link | |||
Others: | |||
Classification: | SCI | ||
Source: | Zhang Z F | ||
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