| Details of the Publication | |||
| Paper Code | 1359-6454 | ||
| Title | In-situ observations on the creep-fatigue behaviors of Sn4Ag/Cu solder joints | ||
| Authors | Zhang Q K, Zhang Z F | ||
| Corresponding Author | 张哲峰 | ||
| Title of Journal | ACTA MATERIALIA | ||
| Year | 2011 | ||
| Volume | 59 | ||
| Number | 15 | ||
| Page | 6017-6028 | ||
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| Classification: | SCI | ||
| Source: | Zhang Z F | ||
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