| Details of the Publication | |||
| Paper Code | 0026-2714 | ||
| Title | Effects of Bi segregation on the tensile properties of Cu/Cu3Sn(100) interface | ||
| Authors | Pang X Y, Liu Z Q, Wang S Q, Shang J K | ||
| Corresponding Author | Liu Z Q | ||
| Title of Journal | MICROELECTRONICS RELIABILITY | ||
| Year | 2011 | ||
| Volume | 51 | ||
| Number | 12 | ||
| Page | 2330-2335 | ||
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| Classification: | SCI | ||
| Source: | Liu Z Q | ||
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