Details of the Publication
Paper Code   1359-6454
Title   The formation of stacking fault tetrahedra in Al and Cu: II. SFT growth by successive absorption of vacancies generated by dipole annihilation
Authors   Wang H, Xu D S, Yang R, Veyssière P
Corresponding Author   Wang H
Title of Journal   ACTA MATERIALIA
Year   2011
Volume   59
Number   1
Page   10-18
Abstract  
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Classification: SCI
Source: Xu D S
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