| Details of the Publication | |||
| Paper Code | 1431-9276 | ||
| Title | Microstructural study on Kirkendall voids formation in Sn-containing/Cu solder joints during solid-state aging | ||
| Authors | Liu Z Q, Shang P J, Tian F F, Li D X | ||
| Corresponding Author | Liu Z Q | ||
| Title of Journal | MICROSCOPY AND MICROANALYSIS | ||
| Year | 2013 | ||
| Volume | 19 | ||
| Number | Suppl 4 | ||
| Page | 105-108 | ||
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| Classification: | SCI | ||
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